SI - Product - ALCHEMIST

SI

All ALCHEMIST products are designed to meet the standards required in industrial fields, and based on accumulated technological expertise, our durability, precision, and stability are further enhanced for reliable use.

Electrode

RF power is applied to gas introduced through micro-holes
in the electrode to perform dry etching on wafers.

Specification

Item	Electrode
Process	Etcher
Material	Single Crystal
Parts	Si Electrode
Size	Ø200 ~ 400 mm
Resistivity	Low: < 0.02 Ω·cm Normal: 1~4 Ω·cm High: 60~90 Ω·cm
Gas Hole	Diameter 0.3~1.0mm Roundness < 0.05mm Concentricity < 0.05mm
Surface Finish	Etching / Polishing / Lapping
Appearance	Chipping / Scratch / Crack / Stain Free

Process

Step 01

Rotary
Step 02

CNC
Step 03

Drill
Step 04

Hole Etching
Step 05

MCT
Step 06

Etching
Step 07

Polishing or Lapping
Step 08

RCA Cleaning
Step 09

inspection
Step 10

Packaging

Ring

A core component that controls plasma at the
wafer edge to ensure etching uniformity.

Specification

Item	Ring
Process	Etcher
Material	Single Crystal / Poly Crystal
Parts	Focus Ring, Edge Ring, Insert Ring
Size	Ø200 ~ 600 mm
Resistivity	Low: < 0.02 Ω·cm Normal: 1~4 Ω·cm
Gas Hole	N/A
Surface Finish	Polishing / Lapping / Grinding
Appearance	Chipping / Scratch / Crack / Stain Free